◆ Application for FPD :
- Surface Cleaning for Electrinic Devices (Adhesion
and Bondibility)
- Soldering Intensity for Cell-Phone Module & PCB
- Wire Bonding intensity for BGA
- Hydrophilic Polymer Film
- Surface Cleaning for Small Spot Area
◆
3D Plasma Electrode, APIS-TTM : - W Nozzle Electrode
- Small Area Cleaning Available
- Low Price & High Quality Products
- Customized Configuration
◆ Process Performance : - OLED Gate Pad
| Item |
Not Treatment |
Chemical |
APIS-TTM |
Contact Angle
(ITO & Mo) |
40~50˚ |
|
≤ 6˚ |
ACF접착강도
(g/cm2) |
Spec Out |
900 ~ 1000 |
900 ~ 1352 |
TAB 조건: 180℃ / 15sec / 4Mpa / Teflon Sheet (0.05t)
|
Plasma Treating through Package Chip
(3D Plasma Module)
Wetting on Polymer
BGA Package Substrate
|
