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Today is 2008. 05. 18
 





Semiconductor
AP Plasma
RF Module

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Home ¡· Our Products ¡· AP Plasma ¡·APIS-FTM
 

¡ß Application for FPD :

  • Organic Removal Replacing EUV or Ozone Cleaner
  • Hydrophilic from Hydrophobic
  • Particle Removal
  • Surface Treatment

¡ß Poled Dipole Electrode, APIS-FTM :

  • Patent Pending
  • FPD Application
  • with Wet Process Cleaning Module Optional
  • New System or Remodeling Available
  • Minimized Surface Charge Build-up

¡ß Cost & Technology Competitiveness :

  • Larger Substrate Available
  • Cost Effectiveness under Atmospheric Environment
  • Lowest CoO - very few moving parts and longer life time
  • Productivity Improvement with lower down time
  • Multi-Electrode
  • Customized Configuration
  • Non-toxic Environment (Dry in - Dry out)

¡ß Wettability after APIS-FTM Multi-structured,
    Ar/He Process,5§¯/sec Speed :

  • ITO/Mo/AlNd Layer : 5¢ª, Single Module
  • Cr Layer                : 6¢ª, Double Module

 

 





Plasma on Glass with APIS-FTM




APIS-FTM

 



Contact Angle (LCD-Glass Cleaning)



°æ±âµµ È­¼º½Ã žÈÀ¾ ¹Ý¿ù¸® 347-52
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