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M7000 Dry Etch Series is single wafer dry etcher configured for 4~6 inch and an effective replacement for unstable used equipment.
It is a very effective solution for optical, MEMS, bumps, etc. processes by demonstrating high degree of process reliability for critical applications along with low operating cost.
- Plasma dry etching/ashing system
- Higher performance with lower price
- Etching
for si, poly, metal and nitride film
- Etching for dielectric film, electrode film and noble metal film
- Ashing for low temperature PR removal
- 100~1000㎛ si trench for MEMS devices
- Customizing
back bone (single, multi, cluster system)
- Lower CoC & easy maintenance
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 | M7400
RIE Etcher
4",5",6" Silicon, Glass, GaAs wafer
Poly,Nit,Metal film etching
Higher performance with lower price |
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M7500
ICP Etcher
4",5",6" Silicon, Glass, GaAs wafer
Poly,Nit,Metal(Pt,Cr,Au,Ti,ITO
etc..) film etching
Si-deep trench
Ashing(low temperature) | |
| | | 347-52, Banwol-ri, Taean-eup, Hwaseong-si, Gyeonggi-do, KOREA
Tel : +82-31-205-5925 Fax : +82-31-205-5926 | | ▲
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